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Specific Process Knowledge/Thin film deposition/Deposition of Tantalum: Difference between revisions

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!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Leybold|Leybold]])
! Sputter (Lesker)
! Sputter (Lesker)
|-  
|-  
Line 12: Line 11:
*Up to 1x4" wafers
*Up to 1x4" wafers
*smaller pieces
*smaller pieces
|
*8x4" wafers or
*5x6" wafers
|
|
*up to 1x6" wafer
*up to 1x6" wafer
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| Pre-clean
| Pre-clean
|RF Ar clean
|RF Ar clean
|Ar ion bombartment
|RF Ar clean
|RF Ar clean
|-
|-
| Layer thickness
| Layer thickness
|10Å to 1µm  
|10Å to 1µm  
|10Å to 1500 Å
|10Å to
|10Å to
|-
|-
| Deposition rate
| Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|1Å/s to 5Å/s
|~0.3Å/s
|~0.3Å/s
|-
|-
|}
|}
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