Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter (Lesker) | ! Sputter (Lesker) | ||
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*Up to 1x4" wafers | *Up to 1x4" wafers | ||
*smaller pieces | *smaller pieces | ||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
| Line 25: | Line 21: | ||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| Line 31: | Line 26: | ||
| Layer thickness | | Layer thickness | ||
|10 Å to 1 µm | |10 Å to 1 µm | ||
|10 Å to 1 µm | |10 Å to 1 µm | ||
|10 Å to | |10 Å to | ||
| Line 37: | Line 31: | ||
| Deposition rate | | Deposition rate | ||
|2 Å/s to 15 Å/s | |2 Å/s to 15 Å/s | ||
|1 Å/s to 15 Å/s | |1 Å/s to 15 Å/s | ||
| | | | ||
Revision as of 12:01, 15 August 2011
Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10 Å to 1 µm | 10 Å to 1 µm | 10 Å to |
| Deposition rate | 2 Å/s to 15 Å/s | 1 Å/s to 15 Å/s |
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings