Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
→Recommended dicing parameters: LiNbO3 added |
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|Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm | |Bonded Si/Pyrex||DAD321 ||B1A862 ||0.5 mm/s ||15'000 ||0.5mm | ||
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|LiNbO3**||DAD321 ||B1A862 ||1-3 mm/s ||15'000 ||0.5mm | |||
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(*) Multiple cuts at the same location can be done if deeper cuts are needed | (*) Multiple cuts at the same location can be done if deeper cuts are needed | ||
(**) Tested once 26-05-08, no systematic test done | |||
=== Available blades === | === Available blades === | ||