Specific Process Knowledge/Etch/Etching of Bulk Glass: Difference between revisions
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The set-up consists of a 5L plasic beaker placed on a stirring plate (magnetic stirring) and a special horizontal wafer holder. Normally a 40% pre-mixed HF solution is used. | The set-up consists of a 5L plasic beaker placed on a stirring plate (magnetic stirring) and a special horizontal wafer holder. Normally a 40% pre-mixed HF solution is used. | ||
Masking materials and pre-treatment of the glass surface prior to the deposition of the masking material is a special concern in particular for deep | Masking materials and pre-treatment of the glass surface prior to the deposition of the masking material is a special concern in particular for deep etches (> 10µm). | ||
Due to the high cleanliness fused silica is allowed access to basically all machines meaning that e.g. LPCVD silicon can be deposited as masking material. This is an excellent mask even for quite deep etchings. | Due to the high cleanliness fused silica is allowed access to basically all machines meaning that e.g. LPCVD silicon can be deposited as masking material. This is an excellent mask even for quite deep etchings. | ||