Specific Process Knowledge/Etch/ASE (Advanced Silicon Etch): Difference between revisions
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[[image:ASE.jpg|300x300px|right|thumb|The ICP-DRIE tool at Danchip: STS ASE - positioned in cleanroom2]] | [[image:ASE.jpg|300x300px|right|thumb|The ICP-DRIE tool at Danchip: STS ASE - positioned in cleanroom2]] | ||
The ICP-DRIE (Inductively Coupled Plasma - Deep Reactive Ion Etcher) tool at Danchip is manufactured by STS and is called the ASE (Advanced Silicon Etcher). | The ICP-DRIE (Inductively Coupled Plasma - Deep Reactive Ion Etcher) tool at Danchip is manufactured by STS and is called the ASE (Advanced Silicon Etcher). Originally the main purpose of the ASE was etching of silicon using the Bosch process. However, after the acquisition of the [[Specific Process Knowledge/Etch/DRIE-Pegasus|DRIE-Pegasus]] the ASE now only serves as backup silicon dry etcher. It has therefore been decided to diversify the etching possibilities on the ASE by adding a CO<sub>2</sub> gas line in order to open up for polymer etching. | ||
==The Bosch process: Etching of silicon== | ==The Bosch process: Etching of silicon== | ||