Specific Process Knowledge/Etch/Wet III-V Etches: Difference between revisions
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It is very important that you dispose off chemicals and process waste according to DTU Nanolab regulations and risk assessments for your work. | It is very important that you dispose off chemicals and process waste according to DTU Nanolab regulations and risk assessments for your work. | ||
'''For the GaAs and InP waste | '''For the GaAs and InP substrate etching, waste should be collected and marked ''Carcinogenic''. | ||
If it contains H2O2 use empty H2O2 bottles (since they should have a special lid that avoid over pressure). | |||
There should be waste bottles in the fumehood for citric acid: H2O2 or H2SO4 (10%):H2O2 used to etch GaAs and InGaAsP substrates marked '''"for Carcinogenic materials like InP and GaAs in Acid and Hydrogenperoxide".''' | |||
And one for acid etch of InP marked '''"for Carcinogenic materials like InP and GaAs in Acid - ''NO H2O2"''' | |||
This does not apply for etching epilayers. | |||
If you need a new bottle, contact Nanolab. | |||
[[Image:FH07.jpg|300x300px|right|thumb|'Fume hood 07' in cleanroom D3]] | [[Image:FH07.jpg|300x300px|right|thumb|'Fume hood 07' in cleanroom D3]] | ||
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==HCl:H3PO4 etch== | ==HCl:H3PO4 etch== | ||