Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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| [[Image:IMG 20230228 113101.jpg|thumb | |- | ||
|[[Image:IMG 20230228 113101.jpg|thumb|Wafer mounting table for DAD 321]] | |||
|rowspan="2"|[[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]] | |||
|rowspan="2"|[[Image:IMG 20230228 113045.jpg|thumb|Wafer cleaning station DCS 1441]] | |||
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|[[Image:IMG 20230228 113035.jpg|thumb|UV curing/Tape release for DAD 3241]] | |||
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===Comparing dicing parameters for different materials '''DAD 321'''=== | ===Comparing dicing parameters for different materials '''DAD 321'''=== | ||
Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters | Do not mix blades for the DAD 321 with the blades for the DAD 3241. They have different outer diameters | ||