Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions

Revision as of 11:07, 29 January 2026

Feedback to this page: click here

Disco Automatic dicing saw, model DAD321 and DAD3241

DTU nanolab has 2 saw available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.

The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.

In general it is not allowed to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions here to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.

Dicing layout

Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the entire wafer. Please see the illustrations for a good and a bad design.


GOOD design - simple	GOOD design - complex	BAD design

GOOD design - simple	GOOD design - complex	BAD design
	drawings by Jesper Hanberg, DTU Nanolab

Process information

The user manual, user APV, technical information and contact information can be found in LabManager:
- DAD 321 Saw in LabManager
- DAD 3241 Saw in LabManager

Comparing dicing parameters for different materials

Available blades

THIS CHAPTER IS WORK IN PROGRESS

DISCO provides a wide selection of dicing blades optimized for different materials. There catalogue can be accessed online here DTU Nanolab provides 2 different blades for 2 main use-cases

@@ Line 1: / Line 1: @@
 '''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]'''
-==Disco Automatic dicing saw, model DAD321 (old) and DAD3241 (new 2021)==
+==Disco Automatic dicing saw, model DAD321 and DAD3241==
-The dicers feature versatile processing capabilities, compact designs, and high precision and reliability. Users perform workpiece loading, alignment, and unloading manually.
+DTU nanolab has 2 saw available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability.
-The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this is not a cleanroom and that the dicing process is very dirty.
+The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device.
-<!--
-[[Image:Disco_DAD_321_Dicer.jpg|thumb|Dicer positioned on 1. floor bldg 346 room 157]]
-[[Image:DAD_3241_picture.jpg|thumb|Dicer positioned on 1. floor bldg 346 room 157]]
--->
-In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned in the gowning area and get a Piranha cleaning. You will only be allowed to use a limited number of tools for the processing after dicing.
+[[File:IMG_20230228_112922.jpg|center|thumb||Dicers positioned on 1. floor bldg 346 room 157]]
+<div style="clear: both"></div>
-[[File:IMG_20230228_112922.jpg|thumb|800px|Dicers positioned on 1. floor bldg 346 room 157]]
+In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing.
-Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the wafer and you can not end a line in the middle of the wafer.
+===Dicing layout===
+Please consider your layout of dies on your wafer. The dicer can only cut straight lines across the entire wafer.
 Please see the illustrations for a good and a bad design.
@@ Line 41: / Line 40: @@
 *[[Specific Process Knowledge/Back-end processing/Disco Saw#Comparing dicing parameters for different materials |Comparing dicing parameters for different materials]]
-*[[Specific Process Knowledge/Back-end processing/Disco Saw#Images of diced samples |Images of diced samples]]
+<!--*[[Specific Process Knowledge/Back-end processing/Disco Saw#Images of diced samples |Images of diced samples]]
 *Dicing work sheet: [[Media:Dicing Work Sheet v2.docx |Dicing Work Sheet v2.docx]] Fill out before requesting dicing.