Specific Process Knowledge/Etch/DryEtchProcessing/Comparison: Difference between revisions

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@@ Line 16: / Line 16: @@
 ! style="background:silver; color:black" colspan="4" align="center"| [[Specific Process Knowledge/Etch/DRIE-Pegasus| DRIE-Pegasi]]
 ! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/ICP_Metal_Etcher| ICP Metal etch ]]
-! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/III-V RIE |III-V RIE ]]
 ! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/III-V ICP|III-V ICP]]
 ! style="background:silver; color:black" rowspan="2"  align="center"| [[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]]
@@ Line 34: / Line 33: @@
 | style="background:WhiteSmoke; color:black"| Etching of silicon oxides or nitrides on 6" wafers
 | style="background:WhiteSmoke; color:black"| Standard recipes for etching of Al, Cr and Ti, now also etches of W, TiW and Mo. Please do not use this machine with F-chemistry unless the Dry Etch group has allowed it!
-| style="background:WhiteSmoke; color:black"| Etching of silicon oxide, resist, BCB, silicon nitride, InP, InGaAs and GaAs on III-V substrates
 | style="background:WhiteSmoke; color:black"| Etching of III-V materials such as GaN, InP/InGaAsP/InGaAs, AlGaAs, GaAs.
 Etching of SiO2 and SiN on III-V materials
@@ Line 42: / Line 40: @@
 | style="background:lightgrey; color:black" | Backup silicon etcher
 | style="background:lightgrey; color:black" |
-| style="background:lightgrey; color:black" | Barc etch
+| style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" colspan="2"|
 | style="background:lightgrey; color:black" | Silicon etcher
-| style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" |
 | style="background:lightgrey; color:black" |
@@ Line 56: / Line 53: @@
 | style="background:WhiteSmoke; color:black" colspan="4" | Inductively coupled plasma chamber with two RF generators; the coil (with outer and inner coil) and platen generator
 | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator
-| style="background:WhiteSmoke; color:black" | Parallel plate capacitor setup with RF power between the two electrodes
 | style="background:WhiteSmoke; color:black" | Inductively coupled plasma chamber with two RF generators; the coil and platen generator
 | style="background:WhiteSmoke; color:black" | Ion beam etcher - sputter etches with argon ions
@@ Line 66: / Line 62: @@
 | style="background:lightgrey; color:black" colspan="4" | The electrode is oil cooled. Also, Helium backside cooling: -20<sup>o</sup>C to 30<sup>o</sup>C
 | style="background:lightgrey; color:black" | The electrode is oil cooled. Also, Helium backside cooling: -10<sup>o</sup>C to 50<sup>o</sup>C
-| style="background:lightgrey; color:black" | The electrode is oil cooled: Fixed at 20<sup>o</sup>C
 | style="background:lightgrey; color:black" | The electrode is oil cooled with a special chiller. Also, Helium backside cooling: 20<sup>o</sup>C to 180<sup>o</sup>C
 | style="background:lightgrey; color:black" | The electrode is oil cooled with a special chiller. Also, Helium backside cooling: 5<sup>o</sup>C to 60?<sup>o</sup>C
@@ Line 77: / Line 72: @@
 | style="background:WhiteSmoke; color:black" colspan="3" | Electrostatic clamping (TDESC)<br> Wafer size 6"
 | style="background:WhiteSmoke; color:black" | Electrostatic clamping (TDESC)<br> Wafer size 6"
-| style="background:WhiteSmoke; color:black" | No clamping<br> Sample size up to 4"
 | style="background:WhiteSmoke; color:black" | Mechanical clamping (weighted clamp with ceramic fingers)<br> Wafer size 4"
 | style="background:WhiteSmoke; color:black" | Mechanical clamping <br> Wafer sizes 2"/4"/6"/8"
@@ Line 154: / Line 148: @@
 | HBr
-|}
-| style="background:lightgrey; color:black" |
-{|
-| O<sub>2</sub>
-| CHF<sub>3</sub>
-| CH<sub>4</sub>
-|-
-| Ar
-| H<sub>2</sub>
 |}
 | style="background:lightgrey; color:black" |
@@ Line 208: / Line 193: @@
 * Coil generator
 * Platen generator
-|  style="background:WhiteSmoke; color:black" |
-* RF generator
 |  style="background:WhiteSmoke; color:black" |
 * Coil generator
@@ Line 225: / Line 208: @@
 | style="background:lightgrey; color:black" colspan="2"| Loading via two cassette loading stations pumped down at vacuum
 | style="background:lightgrey; color:black" | Loading via dedicated two-slot carousel load lock
-| style="background:lightgrey; color:black" | Manual loading directly into process chamber
 | style="background:lightgrey; color:black" | Loading via dedicated two-slot carousel load lock
 | style="background:lightgrey; color:black" | Automatic loading via load lock
@@ Line 256: / Line 238: @@
 * Parameter ramping
 * Optical endpoint detection
-|  style="background:WhiteSmoke; color:black" |
-* Laser endpoint detection
 |  style="background:WhiteSmoke; color:black" |
 * Parameter ramping
@@ Line 297: / Line 277: @@
 * Al, Cr, Ti, W, Mo, Nb
 * Resists
-| style="background:lightgrey; color:black" |
-* Silicon, Silicon oxide, silicon nitride
-* Fused silica
-* Sapphire
-* SiC
-* GaAs, GaN, InP, with epitaxial layers
-* Resists (at low temperature processing)
 | style="background:lightgrey; color:black" |
 * Silicon, Silicon oxide, silicon nitride
@@ Line 323: / Line 296: @@
 | style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=456 Link]
 | style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=266 Link]
-| style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=155 Link]
 | style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=268 Link]
 | style="background:WhiteSmoke; color:black" | [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=267 Link]
 |-
 |}