Specific Process Knowledge/Lithography/UVExposure/aligner MLA4

Aligner: Maskless 04

Aligner: Maskless 04 is located in PolyFabLab in building 347.

The logon password for the PC is "mla" (without quotation marks).

The µMLA Tabletop Maskless Aligner from Heidelberg, located in PolyFabLab in building 347, is a direct exposure lithography tool installed in 2024. It is a UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of a mask. The system offers top side alignment with good accuracy.

Link to information about alignment mark design.

The user manual and contact information can be found in LabManager:

Equipment info in LabManager - requires login

Process information

• Exposure technology
• Process parameters
• Substrate positioning
• Alignment

Equipment performance and process related parameters

Purpose		Alignment and UV exposure
Performance	Exposure mode	Projection (Raster mode) Direct laser writing (Vector mode)
	Exposure light	365nm (LED) for projection 405nm (diode laser) for direct laser writing
	Focusing method	Pneumatic or Optical
	Minimum structure size	Down to 1µm
	Design formats	GDS-II CIF DXF Gerber HIMT format
	Alignment modes	Top side only, ±1µm
Substrates	Substrate size	maximum writing area: 150x150 mm2 150 mm wafer 100 mm wafer 50 mm wafer pieces down to 3x3 mm2 with optical autofocus
	Allowed materials	All PolyFabLab materials with sufficient stiffness and flatness. Total height variation across the substrate must be less than ±80 µm - including wafer bow
	Batch	1