Specific Process Knowledge/Lithography/Development/UV developer: Difference between revisions
Created page with "==Developer TMAH UV-lithography== 400px|right|thumb|Developer: TMAH UV-lithography is located in E-4. Developer TMAH UV-lithography was released Q4 2014. Link to information about developer chuck size and hotplate pin positions. '''[https://www.youtube.com/watch?v=fs9DRH0Eo3k Training video]''' The user manual, user APV, and contact information can be found in [..." |
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=Developer TMAH UV-lithography= | |||
[[Image:SUSS DEV.JPG|400px|right|thumb|Developer: TMAH UV-lithography is located in E-4.]] | [[Image:SUSS DEV.JPG|400px|right|thumb|Developer: TMAH UV-lithography is located in E-4.]] | ||
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*[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing#Standard Processes|Standard processes]] | *[[Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing#Standard Processes|Standard processes]] | ||
=Equipment performance and process related parameters= | |||
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Revision as of 12:03, 12 January 2026
Developer TMAH UV-lithography
Developer TMAH UV-lithography was released Q4 2014.
Link to information about developer chuck size and hotplate pin positions.
The user manual, user APV, and contact information can be found in LabManager - requires login
Process Information
| Purpose |
Development of
| |
|---|---|---|
| Developer |
AZ 726 MIF (2.38% TMAH in water) | |
| Method | Development |
Puddle |
| Handling |
Vacuum chuck | |
| Process parameters | Temperature |
Room temperature |
| Agitation |
Rotation | |
| Rinse |
DI water | |
| Substrates | Substrate size |
|
| Allowed materials |
Silicon and glass substrates Film or pattern of all except Type IV | |
| Batch |
1-25 |