Specific Process Knowledge/Lithography/UVExposure/aligner MLA2: Difference between revisions
Created page with "==Aligner: Maskless 02== 400px|thumb|Aligner: Maskless 02 is located in E-5. MLA150 WMII maskless aligner from Heidelberg Instruments GmbH (installed 2019 as WMI (0.6µm resolution), rebuilt to WMII 2023). '''Special features''' *Optical Autofocus *Backside Alignment *Basic Gray Scale Exposure *Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate *High Aspect Ratio Mode for exposure of thick resists *200 x..." |
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===Exposure dose and defocus=== | ===Exposure dose and defocus=== | ||
[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_02|Information on UV exposure dose]] | [[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners#Aligner:_Maskless_02|Information on UV exposure dose]] | ||
===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 02 processing|Process information]]=== | ||
