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| Line 239: |
Line 239: |
| It is important to keep in mind that this exposure time is valid ''only'' for a specific combination of exposure source and optical sensor, as well as for a specific development process. | | It is important to keep in mind that this exposure time is valid ''only'' for a specific combination of exposure source and optical sensor, as well as for a specific development process. |
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|
| ==Exposure dose for mask aligners==
| | [[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMaskAligners|Information about the exposure dose for mask aligners can be found here.]] |
| The exposure doses listed below are for ''generic'' good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.
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| | |
| All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH (AZ 726 MIF).
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| | |
| | |
| ===Aligner: MA6-1===
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| The Aligner: MA6-1 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
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| '''Quality control'''<br>
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| Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control.
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| | |
| {| class="wikitable"
| |
| |-
| |
| ! !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Resolution !! Comments
| |
| |-
| |
| ! scope=row| AZ MIR 701
| |
| | Long ago || ? || 1.5 µm || ? || 180 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
| |
| |-
| |
| ! scope=row| AZ MIR 701
| |
| | Long ago || ? || 2.0 µm || ? || 200 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
| |
| |-
| |
| ! scope=row| AZ MIR 701
| |
| | Long ago || ? || 4.0 µm || ? || 400 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
| |
| |-
| |
| ! scope=row| AZ 5214E
| |
| | Long ago || ? || 1.5 µm || ? || 72 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
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| |-
| |
| ! scope=row| AZ 5214E
| |
| | Long ago || ? || 2.2 µm || ? || 80 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
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| |-
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| ! scope=row| AZ 5214E
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| | Long ago || ? || 4.2 µm || ? || 160 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
| |
| |-
| |
| ! scope=row| AZ 5214E<br>Image reversal
| |
| | Long ago || ? || 2.2 µm || ? || ? mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
| |
| |- | |
| ! scope=row| AZ nLOF 2020
| |
| | Long ago || ? || 2.0 µm || ? || 121 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Side wall angle: ~15°<br>For smaller angle (~5°): develop 30 seconds instead
| |
| |-
| |
| ! scope=row| AZ 4562
| |
| | Long ago || ? || 10 µm || ? || 510 mJ/cm<sup>2</sup> || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Multiple exposures with 15 s pauses is recommended<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
| |
| |}
| |
| | |
| '''New resists version in 2023'''<br>
| |
| As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. <span style="color:red">This table contains only information about the <i>old</i> resist versions.</span>
| |
| | |
| <br clear="all" />
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| | |
| ===Aligner: MA6-2===
| |
| The Aligner: MA6-2 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
| |
| | |
| '''Quality control'''<br>
| |
| Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control.
| |
| | |
| {| class="wikitable"
| |
| |-
| |
| ! !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Resolution !! Comments
| |
| |-
| |
| ! scope=row| AZ MIR 701
| |
| | 2023-09-26 || taran || 1.5 µm || Hard contact || 150 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
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| |-
| |
| ! scope=row| AZ 5214E
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| | 2025-09-30 || jehem || 1.5 µm || Hard contact|| 90 mJ/cm<sup>2</sup> || 1.5 µm || '''Not under regular quality control'''<br><br>Development: 60 s puddle
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| |-
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| ! scope=row| AZ 5214E<br>Image reversal
| |
| | 2023-01-11 || jehem || 2.2 µm || Hard contact|| 22 mJ/cm<sup>2</sup> || 2.0 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle
| |
| |-
| |
| ! scope=row| AZ nLOF 2020
| |
| | 2023-09-26 || taran || 2.0 µm || Hard contact || 121 mJ/cm<sup>2</sup> || ? µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle
| |
| |-
| |
| ! scope=row| AZ 4562
| |
| | 2021-12-08 || jehem || 10 µm || Soft contact|| 550 mJ/cm<sup>2</sup> || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle
| |
| |}
| |
| | |
| '''New resists version in 2023'''<br>
| |
| As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions.
| |
| | |
| <br clear="all" />
| |
|
| |
|
| ==Exposure dose for maskless aligners== | | ==Exposure dose for maskless aligners== |
