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Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,716 edits
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===Aligner: Maskless 02===
===Aligner: Maskless 02===
The Aligner: Maskless 02 has a 375 nm laser light source with a FWHM of ~1 nm. All exposures on this tool are made using the optical autofocus system, unless otherwise specified.
The Aligner: Maskless 02 has a 375 nm laser light source with a FWHM of ~1 nm. The test exposures on this tool were made using the optical autofocus system, unless otherwise specified.


'''Quality control'''<br>
'''Quality control'''<br>
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Resist/UVresist"