Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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===Aligner: Maskless 01=== | ===Aligner: Maskless 01=== | ||
The Aligner: Maskless 01 has a 365 nm | The Aligner: Maskless 01 has a 365 nm laser light source with a FWHM of ~1 nm. All exposures on this tool are made using the pneumatic autofocus system. | ||
''' | '''Quality control'''<br> | ||
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E. | |||
{| | {| class="wikitable" | ||
|- | |- | ||
! !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Defoc !! Resolution !! Comments | |||
|- | |- | ||
|- | ! scope=row| AZ MIR 701 | ||
| 2025-10-16 || jehem || 1.5 µm || Fast || 325 mJ/cm<sup>2</sup> || -1 || 1.5 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Tested using dehydration reducing measures | |||
|- | |- | ||
! scope=row| AZ 5214E | |||
| 2025-08-15 || taran || 1.5 µm || Fast|| 110 mJ/cm<sup>2</sup> || -1 || 1.75 µm || See QC data for latest values<br><br>Development: 60 s puddle | |||
|- | |- | ||
| | ! scope=row| AZ 5214E<br>Image reversal | ||
| 2023-04-05 || jehem || 2.2 µm || Fast|| 20 mJ/cm<sup>2</sup><br><span style="color:red">possibly incorrect data</span> || -2<br><span style="color:red">possibly incorrect data</span> || 2.0 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle | |||
| | |||
| | |||
| Fast | |||
| | |||
| < | |||
| | |||
|- | |- | ||
! scope=row| AZ nLOF 2020 | |||
| | | 2023-07-06 || jehem || 2.0 µm || Fast || 180 mJ/cm<sup>2</sup> || 0 || 1.5 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle | ||
| 2023-07-06 | |||
| 2.0 µm | |||
| Fast | |||
| 180 mJ/cm<sup>2</sup> | |||
| 0 | |||
| 1.5 µm | |||
| | |||
| | |||
|- | |- | ||
! scope=row| AZ 4562 | |||
| 2023-04-05 || jehem || 10 µm || Fast|| 1050 mJ/cm<sup>2</sup><br><span style="color:red">possibly incorrect data</span> || -1<br><span style="color:red">possibly incorrect data</span> || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle | |||
|} | |||
'''New resists version in 2023'''<br> | |||
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions. | |||
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br> | '''Dehydration reducing measures used for testing AZ MiR 701:'''<br> | ||
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | ||