Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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===Aligner: Maskless 02=== | ===Aligner: Maskless 02=== | ||
The Aligner: Maskless 02 has a 375 nm laser light source with a FWHM of ~1 nm. All exposures on this tool are made using the optical autofocus system, unless otherwise specified. | |||
''' | '''Quality control'''<br> | ||
Please note that the values listed in the table are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E. | |||
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! !! Date !! Operator !! Film thickness !! Exposure mode !! Dose !! Defoc !! Resolution !! Comments | |||
!Date | |||
! | |||
! | |||
! | |||
!Exposure mode | |||
!Dose | |||
!Defoc | |||
!Resolution | |||
!Comments | |||
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! scope=row| AZ MIR 701 | |||
| 2023-08-21 || taran || 1.5 µm || Quality || 325 mJ/cm<sup>2</sup> || 1 || 1 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle<br><br>Tested using dehydration reducing measures | |||
|- | |- | ||
! scope=row| AZ 5214E | |||
! | | 2024-12-09 || taran || 1.5 µm || Quality|| 100 mJ/cm<sup>2</sup> || 2 || 1.5 µm || See QC data for latest values<br><br>Development: 60 s puddle | ||
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! scope=row| AZ 5214E<br>Image reversal | |||
| 2023-04-17 || jehem || 2.2 µm || Quality|| 35 mJ/cm<sup>2</sup> || 0 || 1.5 µm || '''Not under regular quality control'''<br><br>Reversal bake: 60 s @ 110°C<br>Flood exposure: 500 mJ/cm<sup>2</sup><br>Development: 60 s puddle | |||
|- | |- | ||
! scope=row| AZ nLOF 2020 | |||
! | | 2023-08-21 || taran || 2.0 µm || Quality || 450 mJ/cm<sup>2</sup> || 0 || 1.5 µm || '''Not under regular quality control'''<br><br>Post exposure bake: 60 s @ 110°C<br>Development: 60 s puddle | ||
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| 0 | |||
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! scope=row| AZ 4562 | |||
| 2023-04-19 || jehem || 10 µm || Quality|| 1150 mJ/cm<sup>2</sup> || 0 || ≤5 µm || '''Not under regular quality control'''<br><br>Priming: HMDS<BR>Rehydration after SB: none<br>Exposure: Single exposure<br>Degassing after exposure: none<br>Development: 5 x 60 s multi puddle | |||
|} | |||
'''New writehead'''<br> | |||
As of 2023-03-21 the MLA2 has a new writehead installed, converting it from a write mode 1 tool to a write mode 2 tool. This makes all previous dose/defocus settings obsolete. This table contains only the dose/defocus values for the new writehead. | |||
'''New resists version in 2023'''<br> | |||
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions. | |||
'''Dehydration reducing measures used for testing AZ MiR 701:'''<br> | '''Dehydration reducing measures used for testing AZ MiR 701:'''<br> | ||
The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | The CDA used for the pneumatic autofocus will dehydrate the resist. To reduce this effect, the writehead is parked far away from the write area while setting up the job for at least a few minutes, before starting the exposure. | ||
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===Aligner: Maskless 03=== | ===Aligner: Maskless 03=== | ||
The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. All exposures on this tool are made using the pneumatic autofocus system. | The Aligner: Maskless 03 has a 405 nm laser light source with a FWHM of ~1 nm. All exposures on this tool are made using the pneumatic autofocus system. | ||