Specific Process Knowledge/Lithography/Resist/UVresist: Difference between revisions
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'''New resists'''<br> | '''New resists'''<br> | ||
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. The following table contains only information about the new resist versions. | As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. The following table contains only information about the new resist versions. | ||
'''Quality control'''<br> | |||
Please note that the values listed below are <i>'''not'''</i> routinely tested as part of quality control, except for the resist AZ 5214E. | |||
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!AZ MiR 701 | !AZ MiR 701 | ||
| | | 2025-10-20<br>jehem | ||
| 1.5 µm | | 1.5 µm | ||
| 405 | | 405 | ||
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| Quality | | Quality | ||
| 175 mJ/cm<sup>2</sup> | | 175 mJ/cm<sup>2</sup> | ||
| | | -1 | ||
| 1 µm | | 1 µm | ||
| | |||
Tested using dehydration reducing measures | |||
Post exposure bake: 60 s @ 110°C<br> | |||
Development: 60 s puddle | |||
'''Not under regular quality control''' | |||
|- | |- | ||
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| 0 | | 0 | ||
| 1 µm | | 1 µm | ||
| | | | ||
Development: 60 s puddle | |||
'''See QC data for latest values''' | |||
|- | |- | ||
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| 1 µm | | 1 µm | ||
| | | | ||
Reversal bake: | Reversal bake: 60 s @ 110°C<br> | ||
Flood exposure: | Flood exposure: 500 mJ/cm<sup>2</sup><br> | ||
Development: 60 s puddle | |||
'''Not under regular quality control''' | |||
|- | |- | ||
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| 1 µm | | 1 µm | ||
| | | | ||
Post exposure bake: 60 s @ 110°C<br> | |||
Development: 60 s puddle | |||
'''Not under regular quality control''' | |||
<span style="color:red">'''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''</span> | <span style="color:red">'''Due to the high dose required on this tool, it is recommended to process nLOF on tools with a more appropriate exposure light source'''</span> | ||
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Degassing after exposure: 1 hour (may not be necessary)<br> | Degassing after exposure: 1 hour (may not be necessary)<br> | ||
Development: Multiple puddles, 5 x 60 s | Development: Multiple puddles, 5 x 60 s | ||
'''Not under regular quality control''' | |||
|- | |- | ||