Specific Process Knowledge/Etch/Etching of Chromium: Difference between revisions
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== | ==Wet etching of Chromium== | ||
[[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]] | [[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]] | ||
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this: | |||
# HNO<math>_3</math>:H<math>_2</math>O:cerisulphate - 90ml:1200ml:15g - standard at Danchip | # HNO<math>_3</math>:H<math>_2</math>O:cerisulphate - 90ml:1200ml:15g - standard at Danchip | ||
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== Dry etching of chromium == | |||
On the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] tool a recipe for chromium is being developed. | |||
Revision as of 13:05, 11 July 2011
Wet etching of Chromium

Wet Etch of Chromium can take place in a beaker in this fume hood
Wet etching of chromium at Danchip is done making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. We have two solution for this:
- HNO:HO:cerisulphate - 90ml:1200ml:15g - standard at Danchip
- Commercial chromium etch
Etch rate are depending on the level of oxidation of the metal.
How to mix the Chromium etch 1:
- Take a beaker and add 15g of cerisulphate.
- Add a little water while stirring - make sure all lumps are gone.
- Add water until 600 ml - keep stirring (use magnetic stirring)
- Add 90 ml HNO
- When the cerisulphate is completely dissolved (clear liquid) you can add the other 600 ml of wafer.
Overview of the data for the chromium etches
| Chromium etch 1 | Chromium etch 2 | |
|---|---|---|
| General description |
Etch of chromium |
Etch of chromium |
| Chemical solution | HNO:HO:cerisulphate - 90ml:1200ml:15g | . |
| Process temperature | Room temperature | . |
| Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
. |
| Etch rate |
~40-100 nm/min |
. |
| Batch size |
1-25 wafers at a time |
. |
| Size of substrate |
4" wafers |
. |
| Allowed materials |
No restrictions. Make a note on the bottle of which materials have been processed. |
. |
Dry etching of chromium
On the ICP Metal Etch tool a recipe for chromium is being developed.