Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

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 [[File:Temescal.JPG|400px|right|thumb|The Temescal E-beam evaporator in cleanroom A-5]]
-The E-beam evaporator (Temescal) is a system for depositing metals by electron-beam evaporation. In e-beam evaporation, the deposition is line-of-sight directed from the source, which means it will coat only the surface of the sample facing directly towards the source. This makes it very useful for example for [[Specific Process Knowledge/Lithography/LiftOff|lift-off]]. Nanolab's e-beam evaporators are made by Temescal, a division of FerroTec, and this particular machine was purchased by Nanolab in 2018. It is very similar to the newer e-beam evaporator we have from the same manufacturer, bought in 2023, which we call [[Specific Process Knowledge/Thin film deposition/10-pocket_e-beam_evaporator|E-beam Evaporator (10-pockets)]] in the LabManager system.
+This system allows electron-beam evaporation of thin films (<1 μm) of metals and one semiconductor, Ge. In e-beam evaporation, the deposition is line-of-sight from the source, which means it will coat only the surface of the sample facing the source directly. This makes it useful for example for [[Specific Process Knowledge/Lithography/LiftOff|lift-off]]. Nanolab's current e-beam evaporators were made by Temescal, a division of FerroTec, and this particular machine was purchased by Nanolab in 2018. It is very similar to the newer e-beam evaporator, bought in 2023, called the [[Specific Process Knowledge/Thin film deposition/10-pocket_e-beam_evaporator|E-beam Evaporator (10-pockets)]] in the LabManager system.
-A special feature of the 2018 E-beam evaporator (Temescal) is that it has an ion source for Argon sputtering. This can be used either for ''in situ'' sample cleaning prior to deposition or to modify the film during deposition (ion beam assisted deposition or IBAD).
+A special feature of the 2018 E-beam evaporator (Temescal) is that it has an ion source for argon sputtering. This can be used either for ''in situ'' sample cleaning prior to deposition or to modify the film during deposition (ion beam assisted deposition or IBAD).
-In both Temescal e-beam evaporators, wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all samples that are loaded together. You can load up to four 6" wafers or three 8" wafers for deposition on surfaces facing the evaporation source, or on up to one 6" wafer for tilted deposition. By using sample holder inserts, you can deposit metals on samples of different sizes and shapes. Only one metal can be deposited at a time, but you can deposit many layers of different metals one after the other. The system contains 6 metals at a time and the metals are exchanged based on user requests, so please request the metals you wish well in advance.
+In both Temescal e-beam evaporators, wafers are loaded into the top of the chamber, which acts as a loadlock as it can be separated from the rest of the chamber by a large gate valve. Deposition will happen on all loaded samples. Up to four 6" wafers /three 8" wafers may be loaded for line-of-sight deposition, or up to one 6" wafer for tilted deposition. Only one material can be deposited at a time, but layers of different metals may be deposited one after the other. The system contains 6 materials at a time which are exchanged weekly based on user requests. Please request materials well in advance.
 '''The user manual, user APV, and contact information can be found in LabManager:'''