Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/processD: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jml (talk | contribs)
Bureaucrats, danchip, Administrators
1,918 edits
No edit summary
Jml (talk | contribs)
Bureaucrats, danchip, Administrators
1,918 edits
No edit summary
Line 1: Line 1:
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Process A specifications'''
|+ '''Process D specifications'''
|-
|-
! Parameter
! Parameter
Line 8: Line 8:
! Etch rate (µm/min)   
! Etch rate (µm/min)   
| Not specified
| Not specified
| 18.9
| 2.88
|-
|-
! Etched depth (µm)
! Etched depth (µm)
| 150
| 20-30
| 189.1
| 28.75
|-
|-
! Scallop size (nm)
! Scallop size (nm)
| < 800
| < 30
| 718
| 46
|-
|-
! Profile (degs)
! Profile (degs)
| 91 +/- 1
| 85 +/- 5
| 91.1
| 89.7
|-
|-
! Selectivity to AZ photoresist  
! Selectivity to AZ photoresist  
| > 150
| Not specified
| 310
| 50
|-
|-
! Undercut (µm)
! Undercut (nm)
| <1.5
| Not specified
| 0.84
| 65
|-
|-
! Uniformity (%)
! Uniformity (%)
| < 3.5
| < 3.5
| 3.0
| 4.56-0.25
|-
|-
! Repeatability (%)
! Repeatability (%)
| <4
| <4
| 0.43
|  
|-
|-
|}
|}
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/processD"