Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

@@ Line 47: / Line 47: @@
 ,[[Specific Process Knowledge/Thin film deposition/Deposition of Tungsten|Tungsten (W)]] - thinner layers
-Note that to date (May 2022) we have processes available for deposition of Al, Cr, Cu, Ge, Au, Ni, Nb, Pd, Pt, Ag, Ti, W and Ta as well as Ru. If your favorite metal is not available we may be able to buy a target and develop a recipe, just ask.
+Note that to date (August 2025) we have processes available for deposition of Al, Au, Cr, Cu, Ge, Mo, Ni, Nb, Pd, Pt, Ag, Ti, W and Ta as well as Ru (the latter is not available for general use as it is very expensive). We have also tested Sn but found that sputtering gives better results as the evaporated film was very rough.
+If your favorite metal is not available you are welcome to ask if we can develop a recipe.
 ===Thickness measurement, deposition rate and process control===