Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions
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=== Automatic process === | |||
When creating a new recipe, the bonding plan must be defined at the startup. While setting up a new wire, specify the first and second bond locations, this will automatically register the bonding plan (visible in the Bonding Plan screen). | |||
The number of wires created will correspond to the number of bonds required. After registering the wires, check the bond direction under the Wire and Chips columns. These directions may appear as P>P, 1>P, or 1>2. Adjust them as needed to match your bonding requirements. | |||
To perform multiple bonds in sequence, select Continue Package. This will make multiple bonds and ensure the ball is created after each bond process. | |||
[[File:3_longbond_AltoAu_1to2_8microdistance_Auto_test3_2outof3Autosucess.png|400px|left|thumb|Autoprocess with bonding plans for different bond lengths and directions ]] | |||
* For more details contact thcl@dtu.dk or prakus@dtu.dk | * For more details contact thcl@dtu.dk or prakus@dtu.dk | ||