Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions

@@ Line 113: / Line 113: @@
 ! rowspan="3" align="center" style="background:#f0f0f0;"| First Bond
 | Ultrasonic Power (US)
-| 160
+| 150-200
 |-
 | Bond Time
-| 80
+| 80-200
 |-
 | Bond Force
-| 350
+| 250-450
 |-
 ! rowspan="3" align="center" style="background:#f0f0f0;"| Second Bond
 | Ultrasonic Power (US)
-| 180
+| 150-200
 |-
 | Bond Time
-| 80
+| 80-200
 |-
 | Bond Force
-| 350
+| 300-400
 |-
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Wire
@@ Line 140: / Line 140: @@
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Loop
 | Loop Height
-| 500-2500
+| 500(short length bonds)-5000 (long length bonds)
 |-
 | Tail Mode (Clamp Feed Length)
-| 200-350
+| 350-500
 |-
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Temperature
 |-
 | Stage
-|80-120
+|0-120 (No need of temp when high US(>300))
 |-
 ! rowspan="2" align="center" style="background:#f0f0f0;"| Bond Positions
 | First Bond (X1, Y1)
-| Teach first bond
+| Teach first bond to register coordinates
 |-
 | Second Bond (X2, Y2)
-|Teach second bond
+|Teach second bond to register coordinates
+|-
+! rowspan="2" align="center" style="background:#f0f0f0;"|Bond directions
+|-
+|Package (P) & chip (1)
+|P>P
+>1
+P>1
+>P
 |-
 |}