Specific Process Knowledge/Lithography/Coaters/RCD8: Difference between revisions

Revision as of 15:23, 25 August 2025

Spin Coater: RCD8

Spin Coater: RCD8 is a model RCD8 T spin coater from Süss MicroTec with a motorized media arm and Gyrset functionality. It's primary purpose is spin coating of SU-8 resist. The media arm was disabled in 2024.

However, due to the possibility of using a non-vacuum chuck, the spin coater is also suitable for coating of substrates with e.g. textured backsides or membranes.

The user manual, user APV, and contact information can be found in LabManager - requires login

Process information

Equipment performance and process related parameters

Purpose		Spin coating of SU-8 resists Spin coating of PGMEA based AZ resists Spin coating of wafers with structured backside (Edge bead removal)
Resist		manual dispense ~~automatic dispense from syringe~~
Performance	Coating thickness	SU-8 resits: 0.1-200+ µm AZ 5214E: 1.5-3 µm AZ 4562: 8-15 µm AZ MiR 701: 1.5-3 µm AZ nLOF 2020: 2-3.5 µm
Process parameters	Spin speed	Vacuum chuck: 10 - 5000 rpm Non-vacuum chuck: Max. 3000 rpm
Process parameters	Spin acceleration	10 - 3000 rpm/s Max. 1500 rpm/s with Gyrset
Substrates	Substrate size	100 mm wafers 150 mm wafers (vacuum chuck only)
	Allowed materials	All cleanroom materials ?
	Batch	1

@@ Line 24: / Line 24: @@
 *Spin coating of PGMEA based AZ resists
 *Spin coating of wafers with structured backside
-*Edge bead removal
+*(Edge bead removal)
 |-
 !style="background:silver; color:black;" align="center" width="60"|Resist
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 |style="background:WhiteSmoke; color:black"|
 * manual dispense
-* automatic dispense from syringe
+* <strike>automatic dispense from syringe</strike>
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance