Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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This gives an infinite process parameter space.... | This gives an infinite process parameter space.... | ||
== The standard processes: | == The standard processes: Processes A, B, C, D and SOI == | ||
The instrument was accepted on the basis of the performance of 5 processes. These standard processes are described below. | |||
=== How to read the SPTS notation on process recipes === | === How to read the SPTS notation on process recipes === | ||
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=== Process D === | === Process D === | ||
Process D is labelled ''Micro stamp | Process D is labelled ''Micro stamp etch''. | ||
In the acceptance test the process was run on a 150 mm wafer with 12-13 % etch load. | |||
[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D: Recipe, specifications and results]] | [[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D: Recipe, specifications and results]] | ||