Specific Process Knowledge/Etch/DRIE-Pegasus/processB: Difference between revisions
New page: {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" |+ '''Process A specifications''' |- ! Parameter ! Specification ! Average result |- ! Etch rate (µm/min) | > 1... |
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{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | ||
|+ '''Process | |+ '''Process B specifications''' | ||
|- | |- | ||
! Parameter | ! Parameter | ||
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|- | |- | ||
! Etch rate (µm/min) | ! Etch rate (µm/min) | ||
| > | | > 10 | ||
| | | 10.7 | ||
|- | |- | ||
! Etched depth (µm) | ! Etched depth (µm) | ||
| | | 100 | ||
| | | 107 | ||
|- | |- | ||
! Scallop size (nm) | ! Scallop size (nm) | ||
| < 800 | | < 800 | ||
| | | 685 | ||
|- | |- | ||
! Profile (degs) | ! Profile (degs) | ||
| 91 +/- 1 | | 91 +/- 1 | ||
| | | 90.7 | ||
|- | |- | ||
! Selectivity to AZ photoresist | ! Selectivity to AZ photoresist | ||
| > | | > 100 | ||
| | | 183 | ||
|- | |- | ||
! Undercut (µm) | ! Undercut (µm) | ||
| <1.5 | | <1.5 | ||
| 0. | | 0.89 | ||
|- | |- | ||
! Uniformity (%) | ! Uniformity (%) | ||
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! Repeatability (%) | ! Repeatability (%) | ||
| <4 | | <4 | ||
| 0. | | 0.47 | ||
|- | |- | ||
|} | |} | ||
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{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;" | ||
|+ '''Process | |+ '''Process B recipe''' | ||
|- | |- | ||
! | ! | ||