Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions
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The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person. | The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person. | ||
The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type. | The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type. | ||
=== | === HB100 Bonding Parameters – 25 µm Gold Wire=== | ||
{| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;" | |||
|+ style="font-weight:bold; font-size:110%;" | | |||
|- | |||
! rowspan="3" align="center" style="background:#f0f0f0;"| First Bond | |||
| Ultrasonic Power (US) | |||
| 160 | |||
|- | |||
| Bond Time | |||
| 80 | |||
|- | |||
| Bond Force | |||
| 350 | |||
|- | |||
! rowspan="3" align="center" style="background:#f0f0f0;"| Second Bond | |||
| Ultrasonic Power (US) | |||
| 180 | |||
|- | |||
| Bond Time | |||
| 80 | |||
|- | |||
| Bond Force | |||
| 350 | |||
|- | |||
! rowspan="2" align="center" style="background:#f0f0f0;"| Wire | |||
| Wire Diameter | |||
| 25 µm (Gold) | |||
|- | |||
| Wire Detect | |||
| First Bond: 20 / Second Bond: 0 | |||
|- | |||
! rowspan="2" align="center" style="background:#f0f0f0;"| Loop | |||
| Loop Height | |||
| 500-2500 | |||
|- | |||
| Tail Mode (Clamp Feed Length) | |||
| 200-350 | |||
|- | |||
! rowspan="2" align="center" style="background:#f0f0f0;"| Temperature | |||
|- | |||
| Stage | |||
|80-120 | |||
|- | |||
! rowspan="2" align="center" style="background:#f0f0f0;"| Bond Positions | |||
| First Bond (X1, Y1) | |||
| Teach first bond | |||
|- | |||
| Second Bond (X2, Y2) | |||
|Teach second bond | |||
|- | |||
|} | |||