Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions
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|+ style="font-weight:bold; font-size:110%;" | '''HB100 Full Technical Specifications''' | |+ style="font-weight:bold; font-size:110%;" | '''HB100 Full Technical Specifications''' | ||
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! rowspan=" | ! rowspan="4" align="center" style="background:#f0f0f0;"| Bonding Specifications | ||
| Bonding Methods | | Bonding Methods | ||
| Wedge–Wedge, Ball–Wedge, Ribbon, Bump | | Wedge–Wedge, Ball–Wedge, Ribbon, Bump | ||
| Line 58: | Line 58: | ||
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| Bonding Tool Size | | Bonding Tool Size | ||
| 1.58 mm Ø × 19 mm length (0. | | 1.58 mm Ø × 19 mm length (0.0624" × 0.750") | ||
|- | |- | ||
| Wire Termination | | Wire Termination | ||
| Line 68: | Line 68: | ||
|- | |- | ||
| Motorized Z Travel | | Motorized Z Travel | ||
| 100 mm (3. | | 100 mm (3.9") | ||
|- | |- | ||
| X–Y Drive / Resolution | | X–Y Drive / Resolution | ||
| Line 74: | Line 74: | ||
|- | |- | ||
| Motorized X–Y Travel | | Motorized X–Y Travel | ||
| 100 mm (3. | | 100 mm (3.9") | ||
|- | |- | ||
| Max. Component Width | | Max. Component Width | ||
| 400 mm (15. | | 400 mm (15.7") | ||
|- | |- | ||
| Rotation Drive Accuracy | | Rotation Drive Accuracy | ||
| Line 87: | Line 87: | ||
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| Screen Size | | Screen Size | ||
| | | 21" touchscreen | ||
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| Software Environment | | Software Environment | ||
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''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.'' | ''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.'' | ||
===Process parameters for Gold wire (25µm)=== | ===Process parameters for Gold wire (25µm)=== | ||