Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions
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|+ style="font-weight:bold; font-size:110%;" | '''HB100 Full Technical Specifications''' | |+ style="font-weight:bold; font-size:110%;" | '''HB100 Full Technical Specifications''' | ||
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! rowspan=" | ! rowspan="4" align="center" style="background:#f0f0f0;"| Bonding Specifications | ||
| Bonding Methods | | Bonding Methods | ||
| Wedge–Wedge, Ball–Wedge, Ribbon, Bump | | Wedge–Wedge, Ball–Wedge, Ribbon, Bump | ||
| Line 58: | Line 58: | ||
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| Bonding Tool Size | | Bonding Tool Size | ||
| 1.58 mm Ø × 19 mm length (0. | | 1.58 mm Ø × 19 mm length (0.0624" × 0.750") | ||
|- | |- | ||
| Wire Termination | | Wire Termination | ||
| Line 68: | Line 68: | ||
|- | |- | ||
| Motorized Z Travel | | Motorized Z Travel | ||
| 100 mm (3. | | 100 mm (3.9") | ||
|- | |- | ||
| X–Y Drive / Resolution | | X–Y Drive / Resolution | ||
| Line 74: | Line 74: | ||
|- | |- | ||
| Motorized X–Y Travel | | Motorized X–Y Travel | ||
| 100 mm (3. | | 100 mm (3.9") | ||
|- | |- | ||
| Max. Component Width | | Max. Component Width | ||
| 400 mm (15. | | 400 mm (15.7") | ||
|- | |- | ||
| Rotation Drive Accuracy | | Rotation Drive Accuracy | ||
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| Screen Size | | Screen Size | ||
| | | 21" touchscreen | ||
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| Software Environment | | Software Environment | ||
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''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.'' | ''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.'' | ||
===Process parameters for Gold wire (25µm)=== | ===Process parameters for Gold wire (25µm)=== | ||
Revision as of 09:48, 13 August 2025
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TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire (dia.: 33µm). write to the tool responsible person for changing wire. The system has motorized Z-Y-X Axes and Bond Head Rotation. The TPT software has template of recipes allowing user to set up their own process recipe based on type of bonding and wire.
Table: HB100 Full Technical Specifications
| Bonding Specifications | Bonding Methods | Wedge–Wedge, Ball–Wedge, Ribbon, Bump |
|---|---|---|
| Bond Head Capability | One head for Wedge & Ball bonding (tool change only) | |
| Wire Diameter (Gold) | 12–75 µm (0.5–3 mil) | |
| Wire Diameter (Aluminium) | 17–75 µm (0.7–3 mil) | |
| Wire & Ribbon Handling | Ribbon Size | Max. 25 × 250 µm (1 × 10 mil) |
| Wire Spool Size | 2" diameter | |
| Wire Feed Angle / Immersion Depth | 90° deep access / 14 mm immersion | |
| Ultrasonic & Bonding Parameters | Ultrasonic Frequency | 63.3 kHz PLL control (110 kHz option) |
| Ultrasonic Power | 0–10 W | |
| Bond Time | 0–5 seconds | |
| Bond Force | 10–200 cN | |
| Bonding Tool Size | 1.58 mm Ø × 19 mm length (0.0624" × 0.750") | |
| Wire Termination | Bond Head Tear or Clamp Tear | |
| Mechanics & Motion Control | Z-Drive / Resolution | Lead screw motor / 0.5 µm |
| Motorized Z Travel | 100 mm (3.9") | |
| X–Y Drive / Resolution | Linear motors / 0.1 µm | |
| Motorized X–Y Travel | 100 mm (3.9") | |
| Max. Component Width | 400 mm (15.7") | |
| Rotation Drive Accuracy | ±0.5° | |
| Control & Interface | Axis Control | Joystick |
| Screen Size | 21" touchscreen | |
| Software Environment | Industrial PC with Windows | |
| Camera & Optics | Camera System | Dual camera (detail + overview) |
| Magnification | Up to 150× | |
| View Mode | Simultaneous detail & overview | |
| Heater Stage | Size | 90 mm Ø surface (mechanical & vacuum clamping) |
| Temperature Range | Up to 200 °C ±1 °C | |
| Clamping | Mechanical & vacuum |
For detailed information on compatible wires and bonding tools for the HB100, visit the TPT Wires & Tools page.