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Created page with "'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4/Silicon_Nitride_Etch click here]''' =<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>200px= TPT HB100 wire bonder comes with wires and tools and has option for mounting Gold wire (dia.: 25µm) or Aluminum wire..."
 
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===Table: three columns; two and nine rows===


{| border="2" cellpadding="2" cellspacing="1"  
{| border="2" cellpadding="2" cellspacing="1"  
|+ '''Technical Specifications'''
|+ '''HB100 Full Technical Specifications'''
|-
|-
! rowspan="6" align="center"| Bonding Specifications
! rowspan="6" align="center"| Bonding Specifications
| Bonding Methods
| Bonding Methods
| Wedge-Wedge, Ball-Wedge, Ribbon
| Wedge-Wedge, Ball-Wedge, Ribbon, Bump
|-
| Bond Head Capability
| One head for Wedge & Ball bonding (tool change only)
|-
|-
| Wire Diameter (Gold)
| Wire Diameter (Gold)
| 12–75 µm
| 12–75 µm (0.5–3 mil)
|-
|-
| Wire Diameter (Aluminium)
| Wire Diameter (Aluminium)
| 17–75 µm
| 17–75 µm (0.7–3 mil)
|-  
|-
! rowspan="3" align="center"| Wire & Ribbon Handling
| Ribbon Size
| Ribbon Size
| Up to 25 × 250 µm
| Max. 25 × 250 µm (1 × 10 mil)
|-
| Wire Spool Size
| 2" diameter
|-
| Wire Feed Angle / Immersion Depth
| 90° deep access / 14 mm immersion
|-
|-
! rowspan="6" align="center"| Ultrasonic & Bonding Parameters
| Ultrasonic Frequency
| Ultrasonic Frequency
| 63.3 kHz (110 kHz option)
| 63.3 kHz PLL control (110 kHz option)
|-
| Ultrasonic Power
| 0–10 W
|-
| Bond Time
| 0–5 seconds
|-
|-
| Bond Force
| Bond Force
| 10–200 cN
| 10–200 cN
|-
|-
! rowspan="3" align="center"| Motion & Control
| Bonding Tool Size
| X-Y Travel / Resolution
| 1.58 mm Ø × 19 mm length (0.0624” × 0.750”)
| 100 mm / 0.1 µm
|-
| Wire Termination
| Bond Head Tear or Clamp Tear
|-
! rowspan="6" align="center"| Mechanics & Motion Control
| Z-Drive / Resolution
| Lead screw motor / 0.5 µm
|-
| Motorized Z Travel
| 100 mm (3.9”)
|-
| X–Y Drive / Resolution
| Linear motors / 0.1 µm
|-
|-
| Z Travel / Resolution
| Motorized X–Y Travel
| 100 mm / 0.5 µm
| 100 mm (3.9”)
|-
|-
| Rotation Accuracy
| Max. Component Width
| 400 mm (15.7”)
|-
| Rotation Drive Accuracy
| ±0.5°
| ±0.5°
|-  
|-
! rowspan="3" align="center"| Control & Interface
| Axis Control
| Joystick
|-
| Screen Size
| 21” touchscreen
|-
| Software Environment
| Industrial PC with Windows
|-
! rowspan="3" align="center"| Camera & Optics
| Camera System
| Dual camera (detail + overview)
|-
| Magnification
| Up to 150×
|-
| View Mode
| Simultaneous detail & overview
|-
! rowspan="3" align="center"| Heater Stage
| Size
| 90 mm Ø surface (mechanical & vacuum clamping; other sizes available)
|-
| Temperature Range
| Up to 200 °C ±1 °C
|-
| Clamping
| Mechanical & vacuum
|-
! rowspan="3" align="center"| Electrical & Physical
| Power Requirements
| 100–240 V ±10%, 50/60 Hz, 10 A max.
|-
| Dimensions (W × D × H)
| 620 × 750 × 680 mm (24.4” × 29.5” × 26.7”)
|-
|}
|}
''For more information on compatible wires and tools for HB 100, see [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools].''




===Process parameters for Gold wire (25µm)===
===Process parameters for Gold wire (25µm)===
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