Specific Process Knowledge/Characterization/Particle Scanner Takano: Difference between revisions
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- The wafer thickness should be a standard wafer thickness +/- 200 nm. Wafers that thicker than 1 mm need to get an approval from a responsible person.<br /> | - The wafer thickness should be a standard wafer thickness +/- 200 nm. Wafers that thicker than 1 mm need to get an approval from a responsible person.<br /> | ||
- Area Count software function which helps to detect the larger particles (>11um) is not currently equipped but it is available for purchase.<br /> | - Area Count software function which helps to detect the larger particles (>11um) is not currently equipped but it is available for purchase.<br /> | ||
'''The user manual, technical information and contact information can be found in LabManager:''' | |||
'''[https://labmanager.dtu.dk/function.php?module=Machine&view=view&page_id=169 Particle Scanner Takano]''' | |||