Specific Process Knowledge/Etch/HF Vapour Phase Etch: Difference between revisions

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+=The HF Vapour Phase Etcher=
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-= <span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|300px]]
-= Purpose, location and technical specifications =
-[[File:Under_construction.png|thumb|300x300px|Figure 1: 'HF vapour phase etcher 01' is not in the cleanroom yet]]
 The 'HF Vapour Phase Etch' machine (a Primaxx uEtch from SPTS) is a single wafer (or pieces) HF vapor etch machine designed for etching sacrificial silicon oxide layers, primarily to release silicon microstructures in MEMS devices. The process uses anhydrous hydrogen fluoride (HF) gas as etchant and ethanol vapor as catalyst. In this way silicon dioxide can be etched in a dry process and the problems associated with wet etching is avoided (small structures collapse when they are underetched due to surface tension of water).