Revision as of 14:06, 9 August 2025

TPT HB100 Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder K&S 4524

The bonder is currently in building 346 Phoenex lab.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Equipment	TPT HB100 Wire Bonder	Ball Wire Bonder K&S 4524
Purpose	THIS PART IS UNDER CONSTRUCTION Al and Au 25µm wire bonding Wedge and ball wire bonding Au ribbon (100x20µm) bonding (we have tools and wire but it has not been tested)	Au 25µm wire bonding Ball wire bonding
Performance	Manual operation Wedge bonding: recommended min. bonding area 200 µm x 200 µm Ball bonding: recommended min. bonding area 200 µm x 200 µm recommended temperature 120 ^oC.	Semi-automatic and manual operation Bond placement laser pointer recommended min. bonding area 100 µm x 100 µm recommended temperature 120 ^oC.
Substrates	Should be able to withstand the wire bonding temperature Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)

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+=TPT HB100 Wire Bonder =
-'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing/Wire_Bonder#Ball_Wire_Bonder_K.26S_4524 click here]'''
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-==TPT HB100 Wire Bonder ==
 Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.
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 [https://labmanager.dtu.dk/d4mb/show.php?dokId=21233&mach=533 TPT HB100 Wire Bonder]
-==Ball Wire Bonder K&S 4524==
+=Ball Wire Bonder K&S 4524=
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 [[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]