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==Equipment performance and process related parameters==
==Equipment performance and process related parameters==


[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]]
[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>TPT Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<span style="background:#FF2800">THIS PART IS UNDER CONSTRUCTION</span>
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
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|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Manual operation
*Manual operation
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*recommended temperature 120 <sup>o</sup>C.
*recommended temperature 120 <sup>o</sup>C.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center"|Substrates
|style="background:LightGrey; color:black"|Allowed materials
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*Should be able to withstand the wire bonding temperature
*Should be able to withstand the wire bonding temperature

Revision as of 14:02, 9 August 2025

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TPT HB100 Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT HB100 Wire Bonder

Ball Wire Bonder K&S 4524

Is currently in building 346 Pheenex lab.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

K&S 4524 ball wire bonder

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Ball wire bond
Equipment TPT HB100 Wire Bonder Ball Wire Bonder
Purpose

THIS PART IS UNDER CONSTRUCTION

  • Al and Au 25µm wire bonding
  • Wedge and ball wire bonding
  • Au ribbon (100x20µm) bonding
    (we have tools and wire but it has not been tested)
  • Au 25µm wire bonding
  • Ball wire bonding
Performance
  • Manual operation
  • Wedge bonding:
    • recommended min. bonding area 200 µm x 200 µm
  • Ball bonding:
    • recommended min. bonding area 200 µm x 200 µm
    • recommended temperature 120 oC.
  • Semi-automatic and manual operation
  • Bond placement laser pointer
  • recommended min. bonding area 100 µm x 100 µm
  • recommended temperature 120 oC.
Substrates
  • Should be able to withstand the wire bonding temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)


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