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Specific Process Knowledge/Thermal Process/E1 Furnace Oxidation (8"): Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Pevo (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
2,366 edits
Line 72: Line 72:
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*(1 - 50 100 mm wafers)  
*(100 mm wafers - 1-50 wafers)  
*1 - 50 150 mm wafers  
*150 mm wafers - 1-50 wafers
*1 - 25 200 mm wafers  
*200 mm wafers - 1-25 wafers  
|-
|-
| style="background:LightGrey; color:black"|Substrate materials allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
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