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Specific Process Knowledge/Thin film deposition/Deposition of Tantalum: Difference between revisions

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Tantalum can be deposited by e-beam evaporation and sputter deposition. In the chart below you can compare the different deposition equipment.
Tantalum can be deposited by e-beam evaporation and sputter deposition. In the chart below you can compare the different deposition equipment.


==Sputtering of Tantalum in Sputter-System Metal-Nitride(PC3)==
==Sputtering of Tantalum in Sputter-System Metal-Nitride(PC3)==


*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tantalum/Sputtering of Ta in Sputter-System Metal-Nitride-PC3|Sputtering of Ta in Sputter-System Metal-Nitride(PC3)]]. (Recommended approach)
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tantalum/Sputtering of Ta in Sputter-System Metal-Nitride-PC3|Sputtering of Ta in Sputter-System Metal-Nitride(PC3)]]. (Recommended approach)


==Sputtering of Tantalum in Sputter-System (Lesker)==
==Sputtering of Tantalum in Sputter-System (Lesker)==
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