Jump to content

Specific Process Knowledge/Thin film deposition/Deposition of Tantalum: Difference between revisions

Eves (talk | contribs)
Eves (talk | contribs)
Line 14: Line 14:


Tantalum can be deposited by e-beam evaporation and sputter deposition. In the chart below you can compare the different deposition equipment.
Tantalum can be deposited by e-beam evaporation and sputter deposition. In the chart below you can compare the different deposition equipment.
==Sputtering of Tantalum in Sputter-System Metal-Nitride(PC3)==
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Tantalum/Sputtering of Ta in Sputter-System Metal-Nitride-PC3|Sputtering of Ta in Sputter-System Metal-Nitride(PC3)]]. (Recommended approach)


==Sputtering of Tantalum in Sputter-System (Lesker)==
==Sputtering of Tantalum in Sputter-System (Lesker)==