Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride: Difference between revisions
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride/Deposition of Titanium Nitride using Sputter-System Metal-Oxide (PC1)|TiN deposition with reactive sputtering using Sputter-System Metal-Oxide (PC1)]]. | *[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride/Deposition of Titanium Nitride using Sputter-System Metal-Oxide (PC1)|TiN deposition with reactive sputtering using Sputter-System Metal-Oxide (PC1)]]. | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium Nitride/Deposition of Titanium Nitride using Sputter-System Metal-Nitride (PC3)|TiN deposition with reactive sputtering using Sputter-System Metal-Nitride (PC3)]] - preferable option. | |||
==Comparison between sputtering and ALD methods for deposition of Titanium Nitride.== | ==Comparison between sputtering and ALD methods for deposition of Titanium Nitride.== | ||