Specific Process Knowledge/Characterization: Difference between revisions
No edit summary |
|||
| Line 17: | Line 17: | ||
*[[/SEM: Scanning Electron Microscopy/Leo|LEO SEM]] | *[[/SEM: Scanning Electron Microscopy/Leo|LEO SEM]] | ||
*[[/SEM: Scanning Electron Microscopy/Jeol|JEOL SEM]] | *[[/SEM: Scanning Electron Microscopy/Jeol|JEOL SEM]] | ||
*[[/SEM: Scanning Electron Microscopy/Zeiss|Zeiss SEM]] | |||
===[[/AFM: Atomic Force Microscopy|AFM: Atomic Force Microscopy]]=== | ===[[/AFM: Atomic Force Microscopy|AFM: Atomic Force Microscopy]]=== | ||
Revision as of 10:40, 4 July 2011
Choose topic
- Sample imaging
- Topographic measurement
- Stress measurement
- Measurement of film thickness and optical constants
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Other electrical measurements
Choose equipment
SEM: Scanning Electron Microscopy