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Specific Process Knowledge/Thin film deposition/Deposition of Germanium: Difference between revisions

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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!  
!  
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! General description
! General description
|Thermal deposition of Ge
|Thermal deposition of Ge
|Thermal deposition of Ge
|E-beam deposition of Ge
|E-beam deposition of Ge
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|none
 
|none
|none
|Ar ion etch (only in E-beam evaporator Temescal)
|Ar ion etch (only in E-beam evaporator Temescal)
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10 Å to about 2000 Å (in total distributed on all loaded wafers)
|10 Å to about 2000 Å  
|10 Å to about 2000 Å  
|few nm to about 1 µm*  
|few nm to about 1 µm*  
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|-style="background:LightGrey; color:black"
! Deposition rate
! Deposition rate
|0.4 Å/s - ~ 2 Å/s
|1 Å/s  
|1 Å/s  
|1 Å/s - 5 Å/s  
|1 Å/s - 5 Å/s  
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|-style="background:WhiteSmoke; color:black"
! Batch size
! Batch size
|
*24x 2" wafers or
*6x 4" wafers or
*6x 6" wafers or
Many small pieces
|
|
*4x 2" wafers or  
*4x 2" wafers or  
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! Allowed materials
! Allowed materials
|
|
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
|
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
|
|
Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
Almost any that does not degas at your intended substrate temperature. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].