Specific Process Knowledge/Characterization/Dektak XTA: Difference between revisions
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The Dektak XTA stylus profiler from Brüker is used for profiling surfaces of samples with structures in the micro- and nanometer range. The size of the structures that can be measured is limited by the tip dimensions. | The Dektak XTA stylus profiler from Brüker is used for profiling surfaces of samples with structures in the micro- and nanometer range. The size of the structures that can be measured is limited by the tip dimensions. | ||
A profile measurement can be done across a specific structure by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. [[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] of thin films can be done by measuring the wafer bow. However, for predefined measurement programs or stress measurements, we recommend the P17 profiler | A profile measurement can be done across a specific structure by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. [[Specific_Process_Knowledge/Characterization/Stress_measurement|Stress measurements]] of thin films can be done by measuring the wafer bow. However, for predefined measurement programs or stress measurements, we recommend the [[Specific_Process_Knowledge/Characterization/Tencor_P17|P17 profiler]]. | ||