Decommissioned Equipment: Difference between revisions
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* [[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420 | KLA-Tencor Surfscan 6420]] | * [[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420 | KLA-Tencor Surfscan 6420]] | ||
:(replaced by [[Specific Process Knowledge/Characterization/Particle Scanner Takano | Takano WM-7SR]]) | :(replaced by [[Specific Process Knowledge/Characterization/Particle Scanner Takano | Takano WM-7SR]]) | ||
*[[Specific Process Knowledge/Characterization/Profiler/Optical Profiler (Sensofar) acceptance test|Optical Profiler (Sensofar) acceptance test]] | |||
==Lithography Equipment== | ==Lithography Equipment== | ||
Revision as of 17:03, 20 June 2025
List of Decommissioned Equipment
Below is a list of decommissioned equipment that is kept as reference for other Equipment.
Characterization Equipment
- (replaced by Takano WM-7SR)
Lithography Equipment
Thin Film Equipment
- Thin Film Deposition
- Thermal Process
- RTP Jipelec - For rapid thermal annealing of III-V materials and Si-based materials
- APOX furnace - For growing of very thick oxide layers
- III-V Oven (D4) - For oxidation of AlxGaAs layers.
- Old Resist Pyrolysis furnace - For pyrolysis of different resist
- Noble furnace - For annealing and oxidation of non-clean wafers