Decommissioned Equipment: Difference between revisions
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==Thin Film Equipment== | ==Thin Film Equipment== | ||
* Thin Film Deposition | |||
* Thermal Process | |||
:*[[Specific Process Knowledge/Thermal Process/Jipelec RTP|RTP Jipelec]] - ''For rapid thermal annealing of III-V materials and Si-based materials'' | |||
:*[[Specific Process Knowledge/Thermal Process/Furnace APOX|APOX furnace]] - ''For growing of very thick oxide layers'' | |||
:*[[Specific Process Knowledge/Thermal Process/D4 III-V Oven|III-V Oven (D4)]] - ''For oxidation of Al<sub>x</sub>GaAs layers.'' | |||
:*[[Specific Process Knowledge/Thermal Process/Resist Pyrolysis Furnace|Old Resist Pyrolysis furnace]] - ''For pyrolysis of different resist | |||
:*[[Specific Process Knowledge/Thermal Process/Furnace Noble|Noble furnace]] - ''For annealing and oxidation of non-clean wafers'' | |||
==Dry Etch Equipment== | ==Dry Etch Equipment== | ||
Revision as of 15:43, 20 June 2025
List of Decommissioned Equipment
Below is a list of decommissioned equipment that is kept as reference for other Equipment.
Characterization Equipment
- (replaced by Takano WM-7SR)
Lithography Equipment
Thin Film Equipment
- Thin Film Deposition
- Thermal Process
- RTP Jipelec - For rapid thermal annealing of III-V materials and Si-based materials
- APOX furnace - For growing of very thick oxide layers
- III-V Oven (D4) - For oxidation of AlxGaAs layers.
- Old Resist Pyrolysis furnace - For pyrolysis of different resist
- Noble furnace - For annealing and oxidation of non-clean wafers