Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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== Studies of Au deposition processes== | == Studies of Au deposition processes== | ||
[[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited in the Wordentec (machine now decommissioned, but results can still be of interest)'' | [[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited in the Wordentec (machine now decommissioned, but results can still be of interest)'' | ||
===Temperature rise due to Au e-beam evaporation=== | |||
In the Wordentec e-beam evaporation resulted in a temperature rise in the range of 40-80 degrees C according to temperature stickers on the backs of 6 wafers processed sequentially, rising as more wafers were processed. The throw distance (source-substrate distance) was around 45 cm in the Wordentec. The expected temperature rise in our Temescal systems would be assumed to be lower as the throw distance is longer. | |||
== Resistive thermal evaporation of Au == | == Resistive thermal evaporation of Au == | ||