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[[Image:DRIE-Pegasus.jpg |300x300px|thumb|The SPTS Pegasus in the Danchip cleanroom]]
[[Image:DRIE-Pegasus.jpg |300x300px|thumb|The SPTS Pegasus in the Danchip cleanroom]]


== Documents provided by the manufacturer SPTS ==
The SPTS Pegasus user manual can be found here [[Media:SPTS Pegasus user manual.pdf|>HERE<]]
=== Hardware information ===
[[Media:Pegasus_sheet_V8.pdf‎ |Hardware Information - Overview]].
[[Media:Pegasus_specification_v2.4.pdf|Hardware Information - Detailed]].
[[Media:Pegasus_System_Description_&_Differentiation.pdf|The Advantages the Pegasus has over existing Si etchers]].
[[Media:Macs_v2.pdf|Robot Handling System Information ]].
=== Process applications ===
[[Media:Pegasus_AcceptanceTest.pdf|The acceptance test for the DRIE-Pegasus system, April 2010]].
[[Media:Aerospace.pdf‎ |MEMS in Aerospace]].
[[Media:Bio-medical.pdf|Bio Medical]].
[[Media:Energy.pdf|MEMS in Energy]].


==The Bosch process in the DRIE-Pegasus==
[[Media:Nanotechnology.pdf|Nanotechnology]].


[[Media:Packaging-etch.pdf‎ |Packaging Applications]].


[[Specific Process Knowledge/Etch/DRIE-Pegasus/multiplexing|
[[Media:Appl-sheets-4_markets.pdf|General Applications]].
]]






==The Bosch process in the DRIE-Pegasus==


The DRIE-Pegasus takes the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes).  
The DRIE-Pegasus takes the well established Bosch process known from the [[Specific_Process_Knowledge/Etch/ASE_(Advanced_Silicon_Etch)|ASE]] a significant step further. In the ASE the Bosch process has two cycles, etch and passivation. During each cycle the process parameters are kept constant (This is, at least, that is the intention - the reality is that the ideal square function is rarely achieved during process parameter changes).  
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[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch (Under construction)]]
[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch (Under construction)]]
== Documents provided by the manufacturer SPTS ==
The SPTS Pegasus user manual can be found here [[Media:SPTS Pegasus user manual.pdf|>HERE<]]
=== Hardware information ===
[[Media:Pegasus_sheet_V8.pdf‎ |Hardware Information - Overview]].
[[Media:Pegasus_specification_v2.4.pdf|Hardware Information - Detailed]].
[[Media:Pegasus_System_Description_&_Differentiation.pdf|The Advantages the Pegasus has over existing Si etchers]].
[[Media:Macs_v2.pdf|Robot Handling System Information ]].
=== Process applications ===
[[Media:Pegasus_AcceptanceTest.pdf|The acceptance test for the DRIE-Pegasus system, April 2010]].
[[Media:Aerospace.pdf‎ |MEMS in Aerospace]].
[[Media:Bio-medical.pdf|Bio Medical]].
[[Media:Energy.pdf|MEMS in Energy]].
[[Media:Nanotechnology.pdf|Nanotechnology]].
[[Media:Packaging-etch.pdf‎ |Packaging Applications]].
[[Media:Appl-sheets-4_markets.pdf|General Applications]].
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