Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions
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''*'' ''The variation is defined as (Max-Min)/Average for the various points measured on the wafer. The max. point was around the center and the min. somewhere along the edge. The exact location of the maximum thickness depends how the sample is placed relative to the point of maximum material flux. | ''*'' ''The variation is defined as (Max-Min)/Average for the various points measured on the wafer. The max. point was around the center and the min. somewhere along the edge. The exact location of the maximum thickness depends how the sample is placed relative to the point of maximum material flux. | ||
Number for Al 4" no rotation based on QC measurements 2018-2023. | ''Number for Al 4" no rotation based on QC measurements 2018-2023. | ||
Other measurements by Rebecca Ettlinger, Evgeniy Shkondin and Patama Pholprasit 2018-2023'' | Other measurements by Rebecca Ettlinger, Evgeniy Shkondin and Patama Pholprasit 2018-2023'''' | ||