Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions
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*Approx. 6-9 % Wafer-in-Wafer variation on 4" wafers with Al (crucible source) using 3-wafer holder (4 % variation wafer-to-wafer) | *Approx. 6-9 % Wafer-in-Wafer variation on 4" wafers with Al (crucible source) using 3-wafer holder (4 % variation wafer-to-wafer) | ||
*Approx. 6 % variation for 6" wafers with Al (crucible source) with wafer off-center on holder | *Approx. 6 % variation for 6" wafers with Al (crucible source) with wafer off-center on holder | ||
*Approx. 7 % variation for 6" wafers with Al (crucible source) with wafer centered on holder | *Approx. 7 % variation for 6" wafers with Al (crucible source) with wafer centered on holder | ||
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|style="background:LightGrey; color:black"|Pumpdown time | |style="background:LightGrey; color:black"|Pumpdown time | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*about 15 min | |||
*about 15-25 min | |||
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range | ||