|
|
| Line 10: |
Line 10: |
| [[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]] | | [[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]] |
|
| |
|
| The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. | | The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. It can also be used for Cr evaporation for the same purpose, and for evaporation of Ag, Au, Cu, and Ge. We have also attempted to evaporate Zn, but this resulted in heavy contamination of the chamber that required a lot of effort to clean and the process was not stable. If you would like to deposit other metals you are welcome to ask. |
|
| |
| It is not only usable for Al deposition. The thermal evaporator has room for two evaporation sources and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested, so right now only Al and Ag can be evaporated. Cr can also be evapoarated (with very good results), but require a major change in hardware configuration. We have attempted to evaporate Au and Zn but these are not standard processes. If you would like to deposit these or other metals, please talk to the Thin Film group. | |
| | |
| Compared to the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]], the thermal evaporator is quicker to use if you only need to deposit on one wafer or on small samples, as it only takes about 15 minutes to pump down the chamber. You can also deposit thicker layers because the throw distance from source to sample is shorter, so the material use is more efficient: In the thermal evaporator, you get up to 200 nm per metal pellet, whereas in the Wordentec you get about 15 nm per pellet. However, the thickness uniformity is better for large samples in the Wordentec also because of the longer distance from source to sample.
| |
| | |
| So if you want a quick deposition process and/or a relatively thick metal layer, and your samples are small or the thickness uniformity is not critical, then the Thermal Evaporator is a very good choice for you. If you need to deposit on many wafers or you need a more constant layer uniformity across a full 4" or 6" wafer, then the Wordentec is best.
| |
| | |
|
| |
|
| '''The user manual, APV, technical information and contact information can be found in LabManager:''' | | '''The user manual, APV, technical information and contact information can be found in LabManager:''' |
