Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
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== Deposition of Aluminium == | == Deposition of Aluminium == | ||
Aluminium can be deposited by e-beam evaporation, | Aluminium can be deposited by e-beam evaporation, sputtering and thermal evaporation. In the chart at the bottom of the page we compare the different methods and available equipment. | ||
==Sputtering of Aluminium== | ==Sputtering of Aluminium== | ||
Aluminium may be sputter deposited in either the | Aluminium may be sputter deposited in either the single-chamber sputter-system ("Sputter System Lesker") or the cluster-based sputter system ("Sputter-System Metal-Oxide(PC1)" and "Sputter-System Metal-Nitride(PC3)"). See more in links here and the chart below. | ||
*[[index.php?title=Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al sputtering in Sputter System (Lesker)|Al sputtering in Sputter System (Lesker)]] | |||
*[[index.php?title=Specific Process Knowledge/Thin film deposition/Deposition of Aluminium/Al Sputtering in Cluster Lesker PC3|Al Sputtering in Sputter-System Metal-Nitride(PC3)]] | |||
We also used to have Al sputtering in a system called the Wordentec, so we also have some information on that: | |||
*[[/Sputter rates for Al|Sputtering of Aluminium in the Wordentec]] | *[[/Sputter rates for Al|Sputtering of Aluminium in the Wordentec]] | ||
==E-beam evaporation of Aluminium== | ==E-beam evaporation of Aluminium== | ||