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Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''
'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]'''


'''<p style="color:red;">The Polisher/Lapper has been decomissioned end of 2024.</p>


<big>''' Machine decommissioned end of 2024 '''
</big>
== Polisher/Lapper ==
== Polisher/Lapper ==
'''<p style="color:red;">The Polisher/Lapper has been decomissioned end of 2024.</p>


<!-- copyright issue rkc -->
 
<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
Training is required before using th machine. The machine is equipped with a LabManager lock.-->


The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
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