Specific Process Knowledge/Thermal Process/Oxidation/Wet oxidation E1 furnace: Difference between revisions
No edit summary |
mNo edit summary |
||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Oxidation/Wet_oxidation_E1 click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Oxidation/Wet_oxidation_E1 click here]''' | ||
An acceptance test was done after the installation in November 2021 by Tempress. For wet oxidation at 1050 C and 30 minutes, the thickness variation over a wafer was 1.3%(wafer in wafer), over the boat was 0.35%(wafer to wafer) and ran to ran was 0.64%. | An acceptance test was done after the installation in November 2021 by Tempress. For wet oxidation at 1050 C and 30 minutes, the thickness variation over a wafer was 1.3%(wafer in wafer), over the boat was 0.35%(wafer to wafer) and ran to ran was 0.64%. | ||
Latest revision as of 18:19, 10 June 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
Feedback to this page: click here
An acceptance test was done after the installation in November 2021 by Tempress. For wet oxidation at 1050 C and 30 minutes, the thickness variation over a wafer was 1.3%(wafer in wafer), over the boat was 0.35%(wafer to wafer) and ran to ran was 0.64%.
